KUALA LUMPUR: Malaysian Resources Corp Bhd (MRCB) and Taiwan-based TECO Electric & Machinery Co Ltd (TECO) are working towards a strategic partnership for the development, deployment and operational validation of next-generation AI-ready Modular Data Centres (MDC).

In a joint statement, the parties said the MDCs, which are designed to support both air and liquid-cooled cabinet rack platforms, will serve as a testbed to demonstrate the technical and commercial viability of TECO’s modular technology for developing data centres. This will pave the way for similar data centre developments across MRCB’s landbank in the future.

Under the terms of a memorandum of understanding (MOU), MRCB, as the landowner, will lease suitable land parcels with existing power supply allocations to support the deployment and operation of the MDC, while managing all local authority submissions and regulatory approvals.

Both parties will also explore opportunities for the deployment of MDC through a design and build delivery model.

Meanwhile, TECO will drive the project's technical execution by supplying advanced modular data centre technology, specialised engineering solutions and operational management.

Datuk Imran Salim, group managing director of MRCB, said the collaboration with TECO represents another important milestone in MRCB’s strategic diversification into high-performance digital infrastructure.

"Expanding upon our previously announced intention to develop a 65MW AI-ready facility designed for large-scale enterprise workloads, this modular data centre development demonstrates the versatility and our ability to scale up the utilisation of our landbank.

"By integrating TECO’s specialised modular technology with our master development and engineering expertise, we are expanding our capabilities to serve varied market demands. Beyond establishing an early footprint in the modular data centre sector, this project supports our goal of generating long-term recurring revenue and unlocking maximum value from our landbank,” he said.