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On prospects, the group expects its growth momentum to continue through 2026, underpinned by the ongoing recovery in the global technology sector and rising demand linked to artificial intelligence, machine learning and high-performance computing.
The company also expects broader industrial digitalisation trends across manufacturing industries to support demand for its services.
EMIB (Embedded Multi-die Interconnect Bridge 2.5D technology), is directly translating into higher order flows, expanded service engagements, and heightened earnings visibility for 3REN. Because advanced packaging requires high-precision automated handling, rigorous post-silicon validation, and continuous engineering optimization, 3REN’s specialized product engineering and assembly support services are deeply integrated into Intel’s operational workflow.
Big Tech Adoption: Hyperscalers and chip designers—including reported interest and design wins from Google, Amazon, and Nvidia—are actively evaluating or utilizing Intel's EMIB technology for specific AI processors and cost-sensitive ASICs to avoid TSMC's manufacturing queues. [1, 2]
Beyond broader market tailwinds, 3REN stands out as a direct beneficiary of ongoing shifts in global supply chain architecture. As multinational chipmakers diversify their manufacturing footprints and double down on advanced packaging technologies, 3REN’s long-standing relationship with industry giant Intel Corporation serves as a powerful earnings multiplier. Intel’s aggressive deployment of proprietary advanced packaging solutions, most notably Foveros (3D stacking technology) and EMIB (Embedd
EMIB (Embedded Multi-die Interconnect Bridge 2.5D technology), is directly translating into higher order flows, expanded service engagements, and heightened earnings visibility for 3REN. Because advanced packaging requires high-precision automated handling, rigorous post-silicon validation, and continuous engineering optimization, 3REN’s specialized product engineering and assembly support services are deeply integrated into Intel’s operational workflow.
The lower margin was mainly attributable to project mix and higher nonrecurring engineering (“NRE”) costs associated with more complex automated and digitalised solutions and equipment projects. The Group also made higher investments in talent training to strengthen its Product Engineering and Engineering Support Services capabilities in support of increasing customer demand, while mitigating the impact of staff attrition. In addition, the Group has been increasing its automation engineering .
In addition, the Group has been increasing its automation engineering resources and capabilities to support a growing number of automation projects and customer requirements.Notwithstanding the margin compression, the Group continued to strengthen its business pipeline, particularly among customers involved in Artificial Intelligence (“AI”), Machine Learning (“ML”), data centre and advanced packaging applications.
The Group is also investing ahead of demand by expanding its engineering and operational capabilities, including upfront recruitment and start-up costs to support the ramp-up of a new advanced packaging facility for key customers. These investments, together with the expansion of the Group’s automation resources, are intended to enhance its capacity to support increasing customer requirements and position the Group to participate in the next phase of growth in AI and advanced packaging-related .