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我再搬砖过来看看。。
The macro supply-demand dynamics within the advanced packaging arena further strengthen 3REN’s multi-year outlook. With capacity for Taiwan Semiconductor Manufacturing Company’s (TSMC) competing CoWoS (Chip-on-Wafer-on-Substrate) technology remaining tightly constrained, global fabless chip designers are increasingly turning to Intel’s foundry and packaging services to fulfill their urgent high-performance packaging needs. This shift positions Intel to capture substantial pent-up
external demand, which in turn drives significant order book expansion for ecosystem partners like 3REN. Furthermore, Malaysia’s role in this global supply chain is set to reach unprecedented heights upon the completion of Intel’s massive $7 billion "Project Pelican" expansion in Penang and Kulim.
Once operational, this mega-investment will establish Malaysia as Intel’s largest advanced packaging hub outside the United States, permanently solidifying 3REN’s strategic relevance and anchoring its long-term growth within the domestic ecosystem.
The market Intel would be targeting is expanding rapidly. Micron estimates the global HBM market will grow from roughly $35 billion in 2025 to around $100 billion by 2028, a compound annual growth rate of approximately 40%, and has reportedly pulled its $100 billion milestone estimate forward by two years.
Intel CEO Lip-Bu Tan has flagged a potential return to the memory chip business, calling new memory architecture "one of my pet projects" in remarks on the TechSurge: Deep Tech VC Podcast on August 13.
Healthy orderbook supports recovery outlook. As at end-Mar 2026, Cxx's orderbook stood at MYR100m, of which approximately 75% is expected to be recognised over the remaining three quarters of FY26. The orderbook comprises 40% IT services, 30% data centre and networking (including Unique Central), 20% cybersecurity and 10% digital applications and cloud services. The group also has a MYR160m tenderbook, with approximately one-third attributable to Unique Central.