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In the world of advanced packaging, testing isn't just "important"—it’s arguably the most nerve-wracking part of the entire manufacturing process. As we move toward 2030, testing is evolving from a final "quality check" into a high-stakes, multi-stage insurance policy.
The reason is simple: The Cost of Failure. In traditional packaging, if a chip is bad, you lose one chip. In advanced packaging (like a 2.5D AI processor), you are combining multiple expensive HBM (Memory) stacks with a massive
logic processor on a single interposer. If the final test fails, you aren't just losing one chip; you're throwing away thousands of dollars of functional components because they were permanently bonded to one "dud."
I ve already told u all so many times want invest tech stocks go buy la us tech stocks this gabri talk east talk west is useless. Now us tech stocks also retreating what you expect malaysian tech stocks to perform? Lol