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rougly it says the next hot segment is going to be data transmission using fibre optics, not sure how that's related to this company, may be thro its CPO?
Power Management: Emerging growth vertical*
- Power management (voltage regulators, amplifiers) gaining importance given ubiquity across chips.
- Supply chain constraints: Restricted direct sourcing from China → necessitating IP transfer/licensing structures
- Inari working with external R&D/licensing partners (including SG-based structures) to secure design ownership and supply chain control.
Advanced Packaging: Building optionality including Edge AI*
- Investments since FY25 (~RM70m) into SiP (System-in-Package) + FCBGA (targeting Edge AI applications)
- Capability expansion from legacy low-mid FBAR into higher-value integrated modules (e.g., PA duplexers, mixed-signal integration).
- Early traction via Customer consortium
- Enables advanced processes such as wafer-to-PCB direct bonding.
In summary*, while near term could still be overshadowed by the legacy RF gap and FX impact, Photonics/ChipFab drives step-change growth and margin uplift (FY27–28) alongside new RF (FBAR) design wins into FY27 and FY28. Longer-term drivers: Advanced packaging + optical integration position Inari as a broader AI infrastructure enabler, not just a handset proxy.
吉隆坡（5月20日）：Insas Bhd 表示，其全资子公司 Insas Plaza Sdn Bhd 与 Insas Technology Bhd 已出售 1亿股 Inari Amertron Bhd 股票，套现1.86亿令吉，使该投资集团在这家半导体封装与测试（OSAT）公司的持股比例降至9.67%。